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    • PCB Supplies Prepreg Slider
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      Prepreg

      Prepreg materials are used to fabricate multilayer Printed Circuit Boards.

      Prepreg

      Prepreg materials are used to fabricate multilayer Printed Circuit Boards.

      Prepreg

      Prepreg materials are used to fabricate multilayer Printed Circuit Boards.

      Prepreg

      Prepreg materials are used to fabricate multilayer Printed Circuit Boards.

      Prepreg

      Prepreg materials are used to fabricate multilayer Printed Circuit Boards.

      Prepreg

      Prepreg materials are used to fabricate multilayer Printed Circuit Boards.

      Prepreg

      Prepreg materials are used to fabricate multilayer Printed Circuit Boards.

      Prepreg

      Prepreg materials are used to fabricate multilayer Printed Circuit Boards.

      Prepreg

      Prepreg materials are used to fabricate multilayer Printed Circuit Boards.

      Prepreg

      Prepreg materials are used to fabricate multilayer Printed Circuit Boards.

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      Prepreg materials are used to fabricate multilayer Printed Circuit Boards. Our Prepreg offers excellent thermal resistance, due to the special resin system and the low coefficient of thermal expansion in the Z-axis. The glass transition temperature is 135C and it takes over 60 minutes to delaminate the laminate at 260C. The decomposition temperature is 315C.

      Key Features Include:

      • Reinforcement - Woven E-glass
      • Resin System - primary Difunctional epoxy
      • Flame Retardant Mechanism - Bromine epoxy resin
      • Glass Transition - 110C 150C