Prepreg materials are used to fabricate multilayer Printed Circuit Boards. Our Prepreg offers excellent thermal resistance, due to the special resin system and the low coefficient of thermal expansion in the Z-axis. The glass transition temperature is 135°C and it takes over 60 minutes to delaminate the laminate at 260°C. The decomposition temperature is 315°C.
Key Features Include:
- Reinforcement - Woven E-glass
- Resin System - primary Difunctional epoxy
- Flame Retardant Mechanism - Bromine epoxy resin
- Glass Transition - 110°C – 150°C