Immersion Tin - Ormecon CSN7001 is a nano-metal, the Immersion Tin process uses and ion displacement reaction to plate the circuit board surface. When the surface metal finish (tin) has been deposited, the source of electrons is used up and the process is complete. The process is self-limiting because the copper forms an inter-metallic layer that inhibits the immersion reaction. Immersion coatings have become popular as circuit densities have increased and the pitch of surface mount technology components has decreased. This Immersion tin process provides fast efficient tinning of copper PCB's, a single dip at room temperature produces bright tinning in seconds.
Traditional Hot Air Solder leveling is simply not able to cope with he fine pitch tracks and small air gaps on modern boards. A flat attachment pad is paramount in achieving a reliable solder joint with fine pitch parts.
If this tin process is used after copper polish it results in a board with an ultra bright mirror finish (a 30cm+ shine). This leaves a highly solderable anti-oxidizing finish.
Tin Immersion MSDS
Tin Immersion Insturctions
Developing safe processes is of paramount importance to the successful use the products offered on our web site. Utilizing the expertise of the chemists and chemical engineers from diverse fields, has enabled us to bring to you these finishing processes that will give your printed circuits enhanced solderability, longevity and superior aesthetics.
In order to obtain maximum benefit from these processes and utilise them in a safe and efficient manor, users and potential users should familiarise themselves with the heath and safety sheets and the process data sheets available from this web site.